Posted: October 12, 2021 at 5:24 pm EDT|Update: 43 minutes ago

AlixLabs AB announced today that the company has obtained a patent in Taiwan relating to the Atomic Layer Etch Pitch Splitting (APS)

STOCKHOLM, 12 October 2021 / PRNewswire / – AlixLabs from Lund, Sweden, has developed an innovative new method of manufacturing semiconductor components with a high degree of compaction, eliminating several steps in the manufacturing process – Atomic Layer Etch Pitch Splitting (APS) *. The method makes the components cheaper and less resource-intensive to manufacture and may pave a new path for more sustainable mass production of electronics. The process also enables tiny semiconductor components to be manufactured with precision and efficiency, meaning that smaller production facilities in, for example, Europe will be able to manufacture the components with manageable investments. Today, virtually all advanced semiconductor production takes place in the United States and Asia, and mainly in Taiwan and South Korea.

The company is now pleased to announce the first patent granted in Taiwan. Taiwan is one of the most important markets for advanced semiconductor manufacturing and therefore crucial for AlixLabs to protect its innovative APS process by IP. Taiwan’s semiconductor industry, including integrated circuit manufacturing, design and packaging, is an important part of from Taiwan IT industry. Due to its strong capabilities in fab wafer manufacturing and a complete industry supply chain, Taiwan has distinguished itself from its competitors and dominates the world market. Taiwan is the unrivaled leader in the global semiconductor industry, with Taiwan Semiconductor Manufacturing Company (TSMC) alone accounting for over 50% of the global market. In 2020, the sector represented $ 115 billion output. Recently, Terry tsao (曹世 綸), Global Marketing Director and Taiwan president of SEMI, said the country’s semiconductor equipment spending is expected to continue growing in 2022 and replace South Korea as the world’s largest market next year. **

As previously announced (September 28, 2021), Almi Invest and private investors, including NHL professionals Michael, Alexandre and William Nylander, participate in the program for a total of 9 million Swedish kronor ($ 1 million) investment in AlixLabs. The funds will be used for product development and validation of APS technology.

In a statement by Dr Dmitry Suyatin, CTO and co-founder of AlixLabs on the origin of the invention and the R&D activities in Lund, he said, “Our key technology is based on a surprising discovery that sidewalls act as a topographic mask in atomic layer etching processes. This technology has been proven to work for materials as diverse as gallium phosphide (GaP), silicon (Si), and tantalum nitride (TaN) – all of which are critical materials for the semiconductor and electronics industry. optoelectronics. In addition to having already obtained a US patent, we are now delighted to announce that our Taiwan patent has also been granted and we have other pending patent applications ”.

The diploma at AlixLabs for the recently issued patent (TW I739812) in Taiwan issued by the Taiwan Intellectual Property Office (TIPO, ??)

Dr. Mohamed karimi, R&D and Operation Manager, added: “I am delighted that ALixLabs has been awarded a 1 million Swedish kronor APS technology verification project in the fabrication of FinFET and GAA-FET transistor architectures by Vinnova in June 2021“. Dr. Jonas Sundqvist, CEO and Co-Founder of AlixLabs, concluded that “The strategy as we move forward is to successfully transfer APS technology to the processing of 300mm wafers in Dresden, Germany and make it readily available for process demonstration for major IDMs and foundries. We hope not only to reduce semiconductor manufacturing costs, but also to drastically reduce the demand for energy and clean water and the production of greenhouse gases in chip manufacturing. It is not in itself a Green Fab technology. However, it takes a small step in the right direction. “

* Atomic layer etching height division (APS). As stated previously (April 30, 2021), the US Patent Office has approved AlixLabs’ patent application for nanofabrication by ALE Pitch Splitting (APS). The United States Patent Office has granted a patent (US10930515) on February 23, 2021. The patent covers methods for dividing nanostructures into two in a single process step using atomic layer etching (ALE). The method can have a significant impact on the semiconductor industry by enabling sustainable scaling of electronic components and shrink chip designs in a more cost effective manner. The method is complementary to single exposure immersion and extreme UV (EUV) lithography and corresponding multiple pattern technologies such as self-aligned double and quadruple patterns (SADP resp. SAQP) as well as multiple exposure lithography etching. and directed self-assembly (DSA).
** Wikipedia
*** September 15th, 2021-Hsinchu News, SEMI (International Semiconductor Industry Association) https://www.semi.org/zh/world_fab_forecast_fabuctor Industry Association) https://www.semi.org/zh/world_fab_forecast_fab

CONTACT:
Jonas Sundqvist, CEO of AlixLabs, phone +46 767 63 94 67, email [email protected]

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